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輕觸開關(guān)的生產(chǎn)工藝及使用注意事項(xiàng)
時(shí)間：2019-12-27 點(diǎn)擊：次
輕觸開關(guān), 按鍵開關(guān),滑動(dòng)開關(guān),撥動(dòng)開關(guān),檢測開關(guān),等開關(guān)產(chǎn)品的注意事項(xiàng)與使用條件。
4. Precaution注意事項(xiàng) 4.1 Soldering condition 浸焊條件
(1) After switches were soldered, please be careful not to clean switches with solvent
開關(guān)浸焊后,注意不要用溶劑清洗.
(2) In the case of using soldering iron, soldering conditions shall be 280ºC max and 3 sec. max
在使用鉻鐵的情況下,焊錫溫度應(yīng)在300ºC 以下、3 秒以內(nèi).
(3) Right after switches were soldered; please be careful not to load on the knobs of switches.
浸焊后,注意不要在頂部施加負(fù)荷.
4. 2 Design instructions(設(shè)計(jì)中應(yīng)注意的事項(xiàng))
(1) Follow recommended P. W. B. piercing plan in outside drawing page.
印刷基板的安裝孔尺寸參見產(chǎn)品圖.
(2) Design key top as fig. Design inclination of key top 4 deg. max as fig.
(Recommended operating condition.)
擊鍵部設(shè)計(jì)如圖,擊鍵部傾斜度如圖在4 度以內(nèi). (參見操作條件).
4.3 Note(注意點(diǎn))
(1) Please be cautious not to give excessive static load or shock to switches.
注意不要施加超負(fù)荷的壓力或晃動(dòng)開關(guān).
(2) Please be careful not to pile up P. W. B. after switches were soldered.
開關(guān)焊接以后,印刷基板注意不要疊放.
(3) Preservation under high temperature and high humidity or corrosive gas should be avoided
especially. When you need to preserve for a long period, do not open the carton.
保管時(shí)尤其應(yīng)注意避開高濕高溫和有腐蝕性氣體的環(huán)境.如需長時(shí)間保存,請不要打開包裝箱.
(4) Panasert RH and RH6 shall be used as the standard insert machine (use N type clinch).
使用標(biāo)準(zhǔn)插入機(jī)器PANASERT 和RH6（使用N 式釘）
(5) Preservation under high temperature and high humidity or corrosive gas should be avoided especially, when
you need to preserve for a long period, do not open the carton.
特別注意避免將產(chǎn)品保存在高溫、強(qiáng)溫度或有腐蝕性氣體的地方。若長期保存，請勿打開包裝箱。
4. Precaution注意事項(xiàng) 4.1 Soldering condition 浸焊條件
| ITEM項(xiàng)目 | CONDITION條件 |
|
Preheat temperature 預(yù)熱溫度 |
110ºC max (Embilomental temperature of soldering surface of P. W. E) 110ºC 以下(印刷基板焊錫面周圍的溫度) |
|
Preheat time 預(yù)熱時(shí)間 |
60 sec, max 60 秒以內(nèi) |
|
Area of flux 助焊劑的面積 |
1/2 max of P. W. B. thickness 印刷基板厚度的1/2 以內(nèi) |
|
Temperature of solder 焊錫溫度 |
255ºC max 255ºC 以下 |
|
Time of immersion 浸焊時(shí)間 |
Within 5 sec 5 秒以內(nèi) |
|
Soldering number 浸焊次數(shù) |
Within 2 times (But should bring down heat of the first soldering) 2 次以內(nèi) (但應(yīng)把第一次焊錫的溫度降下來) |
|
Printed wiring board 印刷基板 |
Single sided copper-clad laminates 單面銅箔 |
開關(guān)浸焊后,注意不要用溶劑清洗.
(2) In the case of using soldering iron, soldering conditions shall be 280ºC max and 3 sec. max
在使用鉻鐵的情況下,焊錫溫度應(yīng)在300ºC 以下、3 秒以內(nèi).
(3) Right after switches were soldered; please be careful not to load on the knobs of switches.
浸焊后,注意不要在頂部施加負(fù)荷.
4. 2 Design instructions(設(shè)計(jì)中應(yīng)注意的事項(xiàng))
(1) Follow recommended P. W. B. piercing plan in outside drawing page.
印刷基板的安裝孔尺寸參見產(chǎn)品圖.
(2) Design key top as fig. Design inclination of key top 4 deg. max as fig.
(Recommended operating condition.)
擊鍵部設(shè)計(jì)如圖,擊鍵部傾斜度如圖在4 度以內(nèi). (參見操作條件).
4.3 Note(注意點(diǎn))
(1) Please be cautious not to give excessive static load or shock to switches.
注意不要施加超負(fù)荷的壓力或晃動(dòng)開關(guān).
(2) Please be careful not to pile up P. W. B. after switches were soldered.
開關(guān)焊接以后,印刷基板注意不要疊放.
(3) Preservation under high temperature and high humidity or corrosive gas should be avoided
especially. When you need to preserve for a long period, do not open the carton.
保管時(shí)尤其應(yīng)注意避開高濕高溫和有腐蝕性氣體的環(huán)境.如需長時(shí)間保存,請不要打開包裝箱.
(4) Panasert RH and RH6 shall be used as the standard insert machine (use N type clinch).
使用標(biāo)準(zhǔn)插入機(jī)器PANASERT 和RH6（使用N 式釘）
(5) Preservation under high temperature and high humidity or corrosive gas should be avoided especially, when
you need to preserve for a long period, do not open the carton.
特別注意避免將產(chǎn)品保存在高溫、強(qiáng)溫度或有腐蝕性氣體的地方。若長期保存，請勿打開包裝箱。
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